With the rapid development of artificial intelligence and autonomous driving technology, miniaturization, integration, and modularization are the general trend of electronic product design, especially in chip power supply. Designers are looking for higher efficiency, higher power density, better reliability, and smaller package sizes.
The inductors of tertiary power modules that power CPUs and GPUs usually occupy a large surface area, making it challenging to deploy more chips and small-sized resistor and capacitors. Thanks to the development of copper-iron cofiring integrated inductor technology, inductors can be embedded into the PCB and copper plating makes connections and fanout. In some ways, it is the first packaging by PCB embedded technology, which can solve this problem well.
This presentation focuses on the advantages of inductor embedded PCBs, key manufacturing technologies, reliability test, design rules, and typical product shows.