This seminar is a five day event for engineering and PCB design professionals on high-speed PCB design for signal integrity and minimizing electromagnetic interference (EMI). This two-part seminar is methodology based and is not dependent on the use of any specific tool set or simulation software. This seminar will prepare designers to interpret the results of simulations, helping to minimize design respins.
Part one of this seminar builds on basic engineering principles to develop understanding of the key issues of high-speed design for signal integrity. Part two develops these themes further, applying them to serial transmission and to controlling EMI at the PCB level. From a course structure point of view, it is possible for delegates to attend Part one only, and take Part two at a later date if desired.
| Location |
Date |
Time |
Registration Deadline |
| Columbia, MD |
May 4 - May 8 |
8:00 AM - 5:00 PM |
Monday, April 27 |
Seminar Details • Seminar Registration • Send this link to a colleague
In this complimentary seminar you will see firsthand how the Cadence® high-speed PCB design flow addresses the unprecedented challenges of designing the system interconnect of today’s complex designs. Discover how the Cadence Allegro® system interconnect design platform enables you to manage high-speed constraints, identify and address signal integrity issues throughout the entire design process.
If you can’t make it to an on-site seminar or if you have time constraints, attend a virtual seminar from the comfort of your desktop. Like the on-site EMA seminars, there is no charge to attend this virtual event. The High-Speed PCB Design Solutions virtual seminar will be archived and available for on-demand viewing for anyone unable to attend the November 5th event.
| Location |
Date |
Time |
| Online |
Available on-demand |
3 hours |
Virtual Seminar Details • Virtual Seminar Registration • Send this link to a colleague