Routing boards with high-speed interfaces had been a time-consuming, manual process at Cavium. To alleviate scheduling pressures without sacrificing quality of their multi-layer boards, the San Jose, CA, semiconductor company automated the process with the Cadence® Allegro® TimingVision environment. In this 3-minute video, Bill Munroe, principal PCB designer in the company’s Post-Silicon Group, talks about how the technology helped his team achieve 4X faster timing closure on DDR3 and DDR4 memory subsystems.