PCB design is a never-ending cycle—the sooner you can finish one design, the sooner you can get started on the next. Join our webinar and learn how the latest advancements in Cadence® PCB 17.2-2016 technology can help you.
We are not talking about how your design compares to the next guys’, we’re talking about the PCB layer structure of your design, be it rigid, flex, rigid-flex, or using inlay technology. Stackup definition, more specifically accurate stackup definition, is critical for a wide variety of reasons.
For the past 15 years or so, routing high-speed interfaces handling 5Gbps or higher have become more common in many electrical designs. Transitioning high-frequency signals between layers can greatly affect signal integrity when a portion of plated through-hole (PTH) is left unused, forming an electrical stub. In general, these stubs are a source of impedance discontinuities and signal reflections, which become more critical as data rates increase.
Cadence 17.2 QIR 1 adds a host of new capabilities to OrCAD 17.2. Major enhancements added in QIR 1 include: All new 3D engine with clearance checking, Capture web viewer, PSpice model linking upgrades, and Secure and Share Design.
I can read your minds as you digest the features and benefits of our Allegro 17.2-2016 Release. “Oh no, what have they done now to disrupt my environment?” If you have been an Allegro user for many years, you know what I’m talking about. Dot Zero releases as we call them are our chance to make database / schema changes that result in some level of migration disruption. 17.2 effectively is your dot zero release as it combines the content from the Early Access Program 17.0 software with that of 17.2.
PCB Editor 17.2 includes the latest 3D rendering technology for fully realistic 3D views of your design. Upgraded capabilities also include 3D interference checking and cross probing between 3D and 2D views.
When (not if) change happens or scope creeps... the PCB design team is always on the critical path. You can answer this schedule challenge by dynamically scaling resources with the new Concurrent Team Design capabilities in the Allegro 17.2 2016 Release.
For nearly all applications, customers continue to demand smaller, lighter, and more cost-effective products. Competitive pressures also force designers to bring these new products to market at an ever-increasing rate. Designers can deploy flexible PCB materials (flex/rigid-flex) to meet challenging form-factor requirements, eliminate connectors, and improve performance.
The OrCAD/Allegro 17.2-2016 release, the largest in the past 10 years, became available in late April 2016. Since 17.2-2016 includes a database change that usually happens with a dot zero release, many of you may be wondering when the right time to migrate to this new release is.
See the many improvements have been made to the backdrill process in Allegro PCB Designer to assist the PCB designer in managing the backdrill vias/padstacks, route around the backdrill vias/padstacks with accurate DRCs, and real-time feedback.