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Posted on Nov 13, 2018
Easily and quickly identify coupling issues without always having to rely on the SI expert.
Posted on Nov 2, 2018
Double check your DFM rules before signoff with a forced batch check of all rules for your whole design. If you do find something awry, it’s easy to locate and fix in your design.
Posted on Nov 2, 2018
Double check your DFM rules before signoff with a forced batch check of all rules for your whole design. If you do find something awry, it’s easy to locate and fix in your design.
Posted on Nov 2, 2018
Easily ensure test points are accessible in your designs.
Posted on Nov 2, 2018
Check for common copper and component spacing issues that could potentially derail manufacturing and cause a respin.
Posted on Nov 2, 2018
Easily create and assign constraints for manufacturing based on IPC standards and common PCB rules.
Posted on Nov 2, 2018
Remove unused sections of plated through holes in high-speed designs to improve signal integrity on your designs.
Posted on Nov 2, 2018
Measure from true signal origin to end point through vias and through packages, not just the etch, so you can get timing right and ensure signal performance.
Posted on Nov 2, 2018
Visual indicators of length constraints help you meet delay propagation and total etch length goals when placing components.
Posted on Nov 2, 2018
Real-time interactive checks help you easily find and fix common route quality issues that manufacturing DRC signoff checks miss.

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