- San Jose, CA (June 30, 2009) Hitachi Achieves 40% Reduction in PCB Place-and-Route Design Time - Hitachi’s deployment of Cadence® Allegro® Global Route Environment technology significantly streamlines the PCB design process. More >
- Rochester, NY (June 9, 2009) EMA Announces Component Information Portal (CIP) 3.0 - In this latest release EMA integrates the Newark® online electronic components database with Cadence OrCAD® Capture CIS. More >
- San Jose, CA (May 18, 2009) Cadence Introduces Innovative FPGA PCB Co-Design Solution - New scalable solution, powered by Taray Technology, can shorten design-in time, reduce end product cost and mitigate risk. More >
|
- Rochester, NY (April 15, 2009) EMA Announces the Acquisition of DesignAdvance - This acquisition builds on EMA’s EDA portfolio and strengthens their PCB solutions focus with the addition of three DesignAdvance products: CircuitSpace®, CircuitProbe™, and CircuitPlan™. More >
- Rochester, NY (March 11, 2009) EMA Announces CIP 2.2 - The new release of the Component Information Portal™ (CIP) includes an expanded foundation library and support for the new relational database capability within Cadence OrCAD Capture CIS. More >
- San Jose, CA (January 28, 2009) New Cadence Allegro Webinar Series - This series highlights how the latest Allegro and OrCAD 16.2 technologies tackle current and emerging design challenges by providing new and enhanced capabilities to the end user. More >
|