Sigrity Version History

To reduce overall media size and improve installation time, product documentation in PDF format is no longer included in the install media. The PDFs can still be accessed from the Cadence ASK site or the CDA online mode.

The cloud-based help system, Doc Assistant, has been upgraded to version 25.10, which contains several new features and enhancements over the previous version.

All Sigrity Layout Workbench tools feature an intuitive user interface consisting of reorganized menus, streamlined toolbars and options, and vibrant icons to boost efficiency and productivity. In previously releases, UI improvements were available via the User Improved User Interface checkbox. Starting with 25.1, the checkbox has been removed, and the improved UI is available by default.

The File menu provides a new option, Open Example, for quick access to the examples shipped with the installation. This option lets you access all samples and examples with a single click with no need to manually search in the install directory.

The Edit Cutting Boundary dialog box has been enhanced and renamed to the Edit Cutting Polygon dialog box with several options added to provide advanced polygon cutting capabilities. The dialog box can be accessed from the Summary Cutting Polygon icon on the Processing toolbar.

PowerTree supports incremental updates to the topology tree, allowing changes from the schematic to be reflected without rebuilding the entire tree. When a new netlist is generated with minor updates, only the affected portions of the tree are updated. This approach saves time and maintains the existing structure and settings.

The Reuse Stackup dialog box now shows a preview of the reused stackup results in a dedicated pane called the Preview Layers panel when reusing stackup settings form another SPD file. This capability ensures that the reused stackup results are consistent with your simulation goals.

The translation settings available under the Settings tab have been functionally organized under dedicated categories to provide an intuitive experience to Layout Workbench users.

A new setting, Translate Non-Metal Stiffener Shapes into Dielectric Blocks, has been added to convert non-metal stiffener shapes into dielectric blocks during translation. This option is available in the Rigid-Flex tab under Dielectric Mask Layer Options.

A new transmission line template, Coplanar Stripline, has been added to the Trace Editor dialog box.

New and updated Python commands have been added across multiple Layout Workbench tools. The pydoc module can be used to generate the documentation for these commands automatically. An HTML file, sigrity.html, is generated in your home directory. You can open the file in a browser window to view the Python documentation.

To ensure consistent licensing behavior and optimal performance, the number of CPU cores allocated per engine instances is now limited to 8. This serves as a safeguard, as license are typically checked out in increments of 8, and assigning more than 8 CPUs to a signal instance may degrade performance.

A new package type, Direct Die to Die, is added to the Package Setup > Package Type panel. This package type lets you extract the model between die to die directly without BGA. When using this type, ensure that one of the dies is assigned as the Main Die when selecting components in the Wizard dialog box.

The Circuit Generation Wizard now allows selection of all power nets at once during the Impedance Observation and Decoupling Capacitors setup. The Power Net dropdown includes an option for PowerNets, which allows you to select and display all power nets simultaneously.

The Undo operation is now supported for actions such as deleting and disabling impedance operations, editing frequency range, and deleting VRMs or decoupling capacitors.

The flowing TCL commands have been added and enhanced with the new version.

• sigrity::add reusePort -type {vrm|decap|obs} -name {ob*| ob1, ob2, ob3} -path {file path}: Reuses the ports from the SPD file and defines them as VRMs, impedance observations, and more.
• sigrity::update simulation -startFreq {value} -endFreq {value}: Specifies the frequency and time range for a simulation.
• sigrity::update simuType {OPTI|WhatIf|StatisticalAnalysis} -optiType {Chip|EMI}: Configures the analysis type as Device Optimization, What-If Analysis, and statistical analysis for a simulation run.
• sigrity::update deviceOPTI -name {value} -opiObjective {type}: Specifies the optimization objective for a Device Optimization simulation run. The following objectives can be specified:
  • Best Performance vs. Cost
  • Best Performance vs. Area
  • Best Performance vs. Number of Capacitors
  • Best Performance Schemas Overall
• sigrity::update impedanceObservation {object name} -enable {true|false} {!}: Selects an impedance observation function.
• sigrity::update mutualImpedanceSelection -enable {true | false} -portName1 {name} -portName2 {name} {!}: Selects a mutual impedance observation function.

The SI Metrics Automation workflow has been added to automate the PowerSI S-Parameter Assessment workflow. The new workflow provides automated layout-level signal integrity performance evaluation. This workflow can be used to quickly compare up to three board designs with comprehensive signal integrity metrics and waveform visualizations. This workflow is available as a separate executable, SIMetrics_Automation.exe, in the tools/bin directory of your local installation.

The Multiple Structure Simulation workflow in PowerSI includes several enhancements in the GUI to provide users with more ease and flexibility. The workflow pane in both Diagram View and 2D View is updated to display relevant configuration options. Additionally, you can directly access the details of each block present in a topology by right-clicking and selecting the Load Block button.

In the S-Parameter Assessment workflow, the Report dialog box now includes new options to include in the simulation report, including frequency domain, time domain, and other performance metrics.

In the ERC – Trace Imp/Cpl/Ref Check workflow, an option to Include Wirebond while Calculating Impedance/Coupling has been added to the Set up ERC Sim Options dialog box. Check this option to view the impedance and coupling in the wirebonds present in the design.

The following new tutorials have been added to the Sigrity/Systems Analysis documentation set:

• SI Metrics Automation Workflow Tutorial: This tutorial explains the tasks and steps required to simulate and compare board designs with the new SI Metrics Automation workflow.
• PowerSI EMC/EMI Simulation (Radiation) Tutorial: This tutorial walks you through the tasks and steps required to simulate and analyze the radiation effects from traces and edges in designs.

A new command, GDS_LABELPADLAYER, has been introduced to generate nodes based on labels, offering greater flexibility over the existing polygon-based method.

You can now import and merge two ICT technology files with configuration within the technology file to make multi-source integration easier.

Metal-to-metal touch in IC Mode has been added to Layout Workbench Tools. When disabled, a medium layer is automatically inserted between adjacent metals.

The log file previously saved as error.logfile is now saved as translation.log for the GDS to SPD translator to provide an accurate representation of the file content.

Support for encrypted IRCX stackup files is now extended to the Windows operating system.

The GDS to SPD Tutorial has been removed as a standalone document and its content has been added to the Translators User Guide.

A new workflow, Enhanced Design Extraction, is now available to use in XtractIM. This workflow enables you to solve the RLC between dies and capacitors without BGA, use an existing uBump without adding an extra bump for dies, and create a compressed and compact SPICE model.

A new button, Advanced Group Editor, has been added to the MCP Auto Connection window. This button opens the Advanced Group Editor form where you can edit pin groups after importing a PLOC file.

The Component parameters now support the PDN domain, marking the beginning of a specification that describes the connection between two pad rail terminals through an on-die decoupling capacitance PDN model.

XcitePI has been enhanced to handle interposer cases with multiple metal layers between TSVs and TSV bumps. This update also introduces support for adding BRDL_VIA layer via shapes to represent advanced packaging designs.

Support has been added for specifying key physical and material properties of TSV bumps to enhance customization options.

The following TCL commands have been added to XcitePI.

• xpi_ckt_def_remove{<ckt_definition_name>}: Deletes the circuit definition of the specified name.
• xpi_set_net -net {<net_name>} -enable [0 | 1] -visible [0 | 1] -color <color_value>: Enables the net, maxes it visible, and sets its color for better visibility.
• xpi_set_window{<llx>,<lly>,<urx>,<ury>} [<orig_gds>][-residual_remain [0 | 1]]: A new option (residual_remain) has been added to remove the cutting residual.
• xpi_set_tsv[-level <N>] er_ox <value> thick_ox <value> [-er_ox1 <value>][-thick_ox1 <value>] [-er_ox2 <value>][-thick_ox2 <value>] [-via_cond <value>][-sub_cond <value>][-ckt <Ckt_Def_name>][-bump_node <uBump_name>][-m1_node <M1_node_name>][-gnd_node <GND_node_name>][-vth <value>]: New options, thick_ox2 and er_ox2, have been added to define the third oxide layer.

Broadband SPICE now leverages MPI-based passivity enforcement in multicore mode for improved performance. This feature, which is enabled by default, can be deactivated by setting the BBS_MPIPE environment variable to 1.

A new workflow, DC Resistance, is available in the Analysis Workflows of Sigrity Aurora. This workflow computes the DC resistance for specific power and ground nets present in a design. Use this workflow to compute partial resistance or loop resistance for lumped-to-lumped or multiple-to-multiple measurement models. The analysis results of this workflow are displayed in resistance tables that show the measured partial and loop resistances along with a pass or fail status.

A new 3D canvas, Allegro 3DX Canvas, is available in the Interconnect Model Extraction and Topology Extraction workflows for displaying and analyzing 3D net geometries. The new 3DX canvas displays the 3D preview prominently, minimizing surrounding options and controls to create a clutter-free viewing experience.

Sigrity Aurora supports customizable, XML-based workflows to add custom content to the analysis workflows. The custom XML file, ida_custom.xml, can be edited to add content, such as links or custom groups with links, to the existing workflows.

The Thermal Workflow now includes multi-die support.

The Topology Extraction Workflow now supports topology-driven LayoutLink setup to provide the multi-layout SI simulations capability from the layout itself.

Analysis Model Manager includes an option to activate an improved user interface, aimed at supporting an enterprise-level signal integrity library implementation.

A new document, Sigrity Aurora User Guide, has been added in this release. This document describes how to use Sigrity™ Aurora PCB Analysis for checking and analyzing potential signal integrity and power integrity problems. Additionally, the document walks through the user interface elements and various dialogs, windows, and options to configure and run the integrated analysis workflows.

A hierarchical structure can be created with a new subsystem block for topology simplification and design reuse. This new block is available in Topology Explorer, Serial Link Analysis (SLA), Parallel Bus Analysis (PBA), SystemPI (DC IR Drop Analysis, PDN Impedance Analysis, and Power Ripple Analysis).

Reopen the 2D Curves tab with the new 2D Curves Viewer option in the Tools menu.

The Trace Editor includes the Edit Cross-Hatch Plane Library button to model traces over cross-hatch planes. This feature helps evaluate transmission line propagation constants and impedance during the pre-layout stage of rigid-flex design, ensuring optimal performance.

For Layout and Clarity3D blocks, optimized parameters from Sweep Manager or Optimality can be written to a constraint file and backannotated to the Allegro X Constraint Manager.

All Tx jitter present in an AMI model or the Analysis Options panel can be included in the post-processing of the jitter distribution collected over the duration of the simulation.

The Characterization Options section of the Options form allows the minimum and maximum time for automatic detection of the steady state for characterization waveforms can be defined. The circuit simulation stops after the steady state has been reached.

With the Statistical Simulation option selected in the Channel Simulation tab of the Analysis Options panel, the IO Models and Stimulus tab allows for a stimulus offset for statistical simulations.

In the Parallel Bus Analysis workflow, the AMI Builder Wizard allows the creation of AMI models that support Use_Rx_Clock_Input from clock or strobe signals.

The Electromagnetic Interference Simulation workflow can be accessed through the properties of the FDTD-D (Finite Difference Time Domain) block.

The following new compliance kits are available in release 25.1.

• CEI-56G and 112G Medium Reach (MR) Compliance Kits: These compliance kits are used to verify that electrical interferences in networking equipment meet the specifications defined by the Component Electrical IO (CEI) processes for high-speed data transmission.
• MPDI-D Compliance Kit: This kit is used to support differential data signals and to verify that a device’s implementation in the MIPI D-PHY interface adheres to the MIPI Alliance specifications to ensure interoperability and reliable communication between components.
• UCIe Compliance Kit: To support the Universal Chipset Integration Express (UCIe™) Specification v2.0, Topology Workbench offers templates designed for data rates of 16 and 32 Gbps. These templates provide generic IBIS-IMI models and reference channels for both data rates, facilitating improved modeling and simulation of UCIe interfaces.

New templates have been added to the Parallel Bus Analysis workflow for DDR5 and LPDDR5/5X.

The StressedDiamond option is now available in the Mask list in the Measurement Customization window. This option can be used to review stressed eye measurements from the generated measurement report in the Parallel Bus Analysis workflow.

Starting with this release, Optimality Intelligence System Explorer is now supported in the PDN Impedance and Power Ripple Analysis workflow.

A new Target Impedance block has been added to set the resistance and inductance ranges. Only one Target Impedance block can be added to a canvas, and the other blocks on the canvas must be included in its netlist.

Multiple instances of decap models can be assigned to a single what-if block for sweeping. In the Sweep Manager, a single instance of multiple decap models can be swept.

The Generate Report dialog box now has checkboxes to select specific simulation results to include in the report. Additionally, options are available to include frequency spectrum plots with plotting options to show the frequency axis in the log scale and minor gridlines.

The Auto Check Pin Current dialog box includes two new options to balance positive/negative pin current and use absolute values to balance the unequal positive and negative currents imported from the Current Mapping file.

The search functionality in the Set up VRMs, Set up Sinks, and Set up Discretes wizards has been improved to efficiently search for components by name. The Up and Down radio buttons have been removed to provide a simple and effective component search.

The add pdcResist TCL command used to create resistances for all power and ground nets connected with two nodes or components has been improved to create resistance for a specific power or ground net. Additionally, enhancements have been made to support lumped to lumped, lumped to multiple, multiple to lumped, and multiple to multiple models.

The following TCL commands have been added to PowerDC:

• sigrity::query PDCdistribution -layer {name} -result {type} -net {net1, net2, net3 ...}: Generates the hotspot and coldspot point locations within a specific distribution result, such as current, current density, voltage, power density, power loss, and IR drop.
• sigrity::save LayoutView -FileName {filename.png | .bmp}: Exports and saves the layout displayed in the 2D view as an image file in the PNG or BMP format.
• sigrity::export pdcSinkPinRelativeVoltage -filename {filename.csv}: Calculates and exports the voltage values between every set of positive VDD and GND pins in proximity to each other in a layout design.
• sigrity::set UnequalPosNegPinBalance {1| TRUE}: Reverses the polarity of the current value for all positive pins when the current mapping file is imported.
• sigrity::set pdcViaMaxDisplayLength {threshold_length}: Controls the trench via distribution displayed in the 2D view according to a user-specified threshold value.
• sigrity::set pdcNodeEquipotential | pdcpdcNodeEp -Node {node_name} - Equipotential | -EP {0|1} {!}: Sets a node as an equipotential node.

The following enhancements have been made to the Component Geometry Model Editor:

• Support for coaxial open and coaxial wave ports has been added.
• A new port type, Circuit, is now available when the PEC Offset value is greater than 0.
• The default port width for coaxial ports has been increased from 15% to 40%.
• The LGA package type has been replaced with the QFN package type.

The following improvements have been made in the Stackup window for rigid-flex designs in Clarity 3D Layout:

• A rigid-flex design can incorporate a single stackup or multiple stackups. When a design uses a single stackup and no specific zones are defined on the board, a tab labeled Primary is automatically created. This tab acts as the default stackup for the entire board.
• When a new stackup is added, two new tabs, All Stackups and New Stackup, are created automatically.
• When a new layer is added in the All Stackups tab, it is propagated to all existing stackups but not actively used by any of them. If a layer is added within a specific stackup, it is also propagated to all existing stackups but also utilized by the stackup in which it was originally created.
• Any undefined area of the board is automatically assigned to the Primary stackup by default.

A new option, Extrusion Distance, has been added to the Port dialog box for wave ports. This feature extends all geometry and boundary conditions that intersect the wave surface and repositions the wave port to the end of the extended geometry. The extrusion vector is oriented perpendicular to the wave surface and directed away from the propagation path. This enhancement enables more accurate mode excitation and improves the precision of S-parameter calculations.

The Optimality Intelligent System Explorer GUI has been refined to improve usability. The updated interface allows for clearer separation of function parameters and objective functions with a unified form.

Support for Optimality has been added to the Clarity 3D Layout Capacitance Extraction workflow. This enhancement introduces optimization capabilities that improve the efficiency and accuracy of capacitance extraction, enabling better performance tuning and design validation.

The Target File Editor dialog box has been renamed to Spec Editor. It now includes options to specify target values for frequency domain, time domain, and S-parameter results.

A new template, Tabbed Routing (Single Ended), is now available in Clarity 3D Layout. This template can be used to add trapezoidal shapes (tabs) to one or more parallel or non-parallel traces. This helps manage the impedance in the pin field/breakout regions and minimize crosstalk in the open field regions by optimizing the trace geometry.

In the Optimality Sweep workflow, the Optimality Parameters and Sweep Table tabs have been merged into a single Sweep Parameters tab. New buttons have been added to enable generating, checking, importing, and exporting sweep parameters and sample lists, streamlining the setup and analysis of sweep configurations.

The Intelligent Multi-Block Extraction workflow has been enhanced with support for multi-block files in the MBTX format and updates to the MCM flow.

Frequency-based animation has been added for the Real and Imaginary parts of the field quantities. This option allows you to visualize the field behavior across selected frequencies for improved analysis.

Several improvements have been introduced to the near and far field analysis capabilities in Clarity 3D Layout and Clarity 3D Workbench including toggling between linear and log scales, point markers, line markers, creation of dynamic phase animations, probe points and more.

Advanced Net Settings has been added to the Geometry tab of the Options dialog box. This button opens the Sub Net Settings dialog box which allows the setting of a different value for vias, pads, solder balls, and more, based on the enabled nets. This reduces the time required for meshing.

Area and Parameters options have been added to the Advanced Options page of the Options dialog box of the Clarity 3D Layout Inductance Extraction workflow. These options determine the source/sink excitation regions as the area or perimeter of a 2D sheet.

The Metal Type Settings have been enhanced to offer more control over the simulation accuracy and performance:

• PEC: Treats metal objects as perfect electrical conductors, solving fields only on the surface mesh. Most memory-efficient, excludes resistive losses.
• Solve Inside: Solves fields within the volume mesh of the metal. This option is the least memory-efficient and is recommended for explicit DC analysis.
• Broadband Fitting: Combines the DC Thickness and Solve Inside methods to model skin depth effects across a wide frequency range.
• DC Thickness: DC thickness has been optimized for faster simulation and includes sub options:
  • Infinite: Generates a field solution on the surface mesh of the metallic object using only material properties. Not recommended for thin metals at low frequencies.
  • Effective: Generates a field solution on the surface mesh of the metallic object using material properties and thickness. The default setting.
  • Adaptive: Generates a field solution on the surface mesh of the metallic object using material properties and thickness. For complex geometries, the solver uses an adaptive method at each surface mesh element to find the proper thickness.

A new option, New Surface Mesh, has been added to the Mesh tab when Emesh is selected as the meshing algorithm. This option applies an advanced surface meshing method that uses efficient and reliable algorithms to produce a high-quality triangular surface mesh.

A new option, Remove PEC Air Medium of Rigid-Flex Case, has been added for rigid-flex designs. This option removes the air medium from the design when the rigid-flex design is a multi-zone or bending case, the layer material is air or a layer whose name contains “Medium” exists between a PEC layer and a signal layer or the fill-in medium layer is a PEC layer.

The S-Parameter output has been enhanced in Clarity 3D Layout and Clarity 3D Workbench. A legacy Touchstone 1.0 file is output alongside Touchstone 2.0, BNP, and Virtuoso SDP outputs.

The Clarity 3D Setup dialog box has the following improvements:

• A Status column has been added to the Project section. This column displays the status of simulation runs.
• Multiple designs can be added for a simulation even if the simulation is running for an existing design.

A new option, Swap Source and Sink, has been added to the context menu in the Inductance Extraction workflow. This feature can be used to quickly fix incorrect source or sink assignments without reassigning them manually.

Simulation results, including L Full Matrix, L Self Term, and SPICE Model are accessible through their respective tabs.

The default values of the following options have been changed:

• Solution Frequency: By default, this field is enabled and the Single Frequency option is checked.
• Adaptive Refinement Percentage: The default value is now 30%.
• Minimum Number of Consecutive Converged Iterations: The default value is now 2.
• Outer Box Buffer Size: The default offset values of the dx+, dx-, dy+, dy-, dz+, and dz- fields is equal to 20 times the largest dimension of any side or 300mm, whichever is smaller.

The Parameters panel in Clarity 3D Workbench now includes a toolbar for ease of use.

A new option, Use Free Space Wavelength, has been added to the Advanced Options tab of the Simulation Options dialog box. This option ensures the initial mesh sizing is computed using the wavelength in free space at the solution frequency, providing a consistent baseline for meshing dielectric structures.

Additional commands have been added to the Modeler tab in Clarity 3D Workbench to thicken sheets, examine cross-sections, draw cables, and more.

A new button, Define Geometry Precedence, has been added to the Simulation tab. This feature can be used to control how overlapping geometries are rendered by assigning object properties. This can be used for more accurate meshing results, especially in complex models where geometry intersections may affect simulation accuracy.

When a component is imported in Clarity 3D Workbench, the name of the component defined on the Project panel is automatically prefixed to the name of the component parameter in the Parameters panel. If the name of the component is updated, the prefix in the component parameter names is updated automatically.

A new button, Initial Mesh, has been added to the Simulation tab. This option enables early detection of design issues and accelerates the simulation setup process, saving time.

Encrypted connector and antenna models are now available from JAE, Huber+Suhner, and Johanson.

Highly detailed and anatomically accurate human body models based on medical data from the US Library of Medicine’s Visible Human project are now available. Available models include:

• NEVA Comprehensive Human Body Model – Female (requires third-party license)
• NEVA Comprehensive Human Body Model – Male (requires third-party license)
• NEVA Foundational Human Body Model – Female
• NEVA Foundational Human Body Model – Male

Clarity 3D Workbench now features a redesigned user interface built around a modern ribbon layout, offering a structured and streamlined way to access key features. By replacing the traditional drop-down menus, the new ribbon layout organizes commands and options into tabs and groups, ensuring frequently-used commands are readily available and logically categorized.

The following new TCL commands have been added to 3D Layout and 3D Workbench:

• sigrity::export matrix -exportType {CIJ| MaxwellMatrix| SPICEMatrix} -sourceFile {file_path} -destFile {file_path} -unit {unit}: Exports the capacitance results to a file in the specified format.
• sigrity::export selfTermMaxwellMatrix -sourceFile {file_path} -destFile {file_path} - unit {unit}: Exports the capacitance results to a .csv file in the Maxwell format.
• sigrity::load capResult -capResultFile {Capacitance_flow_result_file}: Loads the Cij file containing the capacitance results.
• sigrity::export SPICECkt -sourceFile {file_path} -destFile {file_path}: Exports the capacitance results in the SPICE matrix format to a .ckl file.
• sigrity::load indResult -indResultFile {Inductance_flow_result_file}: Loads the LnP file containing the inductance results.
• sigrity::export LFullMatrix -sourceFile {file_path} -destFile {file_path}: Exports the L full matrix results to a file in the .csv format.
• sigrity::export RFullMatrix -sourceFile {file_path} -destFile {file_path}: Exports the R full matrix results to a file in the .csv format.
• sigrity::export LSelfTerm -sourceFile {file_path} -destFile {file_path}: Exports the L self term results to a file in the .csv format.
• sigrity::export RSelfTerm -sourceFile {file_path} -destFile {file_path}: Exports the R self term results to a file in the .csv format.

The Optimality Intelligent System Explorer GUI has been refined to improve usability. The updated interface provides a clearer separation between function parameters and objective functions, making it easier to configure optimality parameters. It also introduces support for new parameter types, such as Measurement, MidFunction, Auto-termination, and Constraint, offering greater flexibility in defining optimization workflows.

While previewing the power distribution in the Component Model viewer in Celsius Layout and Celsius 3DIC, you can now configure scale factors for power and metal independently through their respective tabs. This separation provides a more organized interface for managing scaling parameters.

Celsius 3D Workbench now features a redesigned user interface built around a modern ribbon layout, offering a structured and streamlined way to access key features. By replacing the traditional drop-down menus, the new ribbon layout organizes commands and options into tabs and groups, ensuring that frequently-used commands are readily available and logically categorized. With the categorized tabs, contextual controls, and updated labels, the Ribbon UI provides a more intuitive, task-focused workflow that boosts productivity for experienced users while reducing the learning curve for new users.

Two new co-simulation options are available for transient analysis, enabling more integrated and accurate Multiphysics modeling:

• Thermal-Stress Co-Simulation: Helps perform combined thermal and mechanical stress analysis to evaluate how temperature variations impact structural integrity.
• Electrical-Thermal-Stress Co-Simulation: Helps run full Multiphysics simulations across electrical, thermal, and mechanical domains.

Polygon shapes and transient power profiles can now be used for greater flexibility in thermal modeling when defining heat sources in Celsius 3D Workbench. You can now define the area of a heat source using polygon shapes and set up a transient power profile to model time-dependent power behavior.

Designs can now be validated before running a simulation with the new Pre-Simulation Validation feature. This helps identify potential issues before the simulation is run, saving time and improving simulation reliability.

When importing an SPD file created in Celsius Layout, Celsius 3D Workbench automatically identifies each VRM phase of a multi-phase VRM and imports them as individual VRM objects. Phases with matching nominal and sense voltages are grouped into a single VRMGroup, reducing manual setup effort and ensuring accurate power modeling.

The ability to analyze post-processing results have been improved with several options added to the context menu for probe line and near field plots. This includes toggling between log and linear scales, point markers, line parkers, creating dynamic phase animations, probe points, and more.

IR Drop results and Mean Time to Failure (MTTF) results can be plotted in field results, enabling improved power integrity analysis and reliability assessment.

Celsius 3DIC workflow now supports a model-based approach that enables direct creation and instantiation of reusable design entities. This refined flow, with the Block Model Manager and Block Instance Manager, simplifies setup and enhances design efficiency, particularly when working with complex multi-die systems. Models can be added, instantiated, and connected within a more intuitive and cohesive environment.

Celsius 3DIC now supports the Optimality Intelligent System Explorer. Optimality uses AI-driven multidisciplinary analysis and optimization (MDAO) technology to optimize designs quickly and efficiently without compromising on accuracy.

Celsius 3DIC now includes support for the Python Power API model, allowing you to implement active power and thermal control strategies with Python scrips. With the Power Python model, you can write and test Python scripts that monitor device templates and apply dynamic power switching strategies. This includes invoking thermal throttling to prevent overheating during high workloads or implementing advanced control mechanisms, such as multi-control and Proportional Integral Derivative (PID) control, that maintain the system in a stable, predictive state by continuously switching power maps between real-time feedback.

Hex Dominant is now available as a meshing algorithm in Celsius 3DIC, enabling structure hexahedral meshing for improved simulation accuracy and convergence. To use this feature, ensure ANSA EBTA CAE is installed and license on your machine.

AI models are a new modeling level for IT Equipment in both Reality DC and Celsius EC Solver. In Celsius EC Solver, the IT equipment can be trained with CFD simulation data from a detailed server model, obtained over multiple scenarios with varying operating conditions. This equipment can then be added to a Reality DC model. The trained model can produce predictions that capture the behavior of IT at a range of operating conditions. AI modeling is available for both air and hybrid-cooled servers and compatible with all coolant connection types available in the software.

When added to a model, the Fluid Surface object creates a top surface of fluid which fills the geometry beneath it in the simulation or flood-fills the entire test chamber or enclosed geometry with fluid. This powerful new functionality can be used to model innovative immersion cooling of IT equipment.

The new Bump Object in Celsius EC Solver can be used to fully represent solder bumps and balls on a PCB, allowing for greater modeling accuracy of intricate package components.

The new Lid Object in Celsius EC Solver can be used to represent the conductive cover of a flip-chip component package, allowing for more customizable geometry on your package designs.

Coolant distribution units (CDUs) can now be modeled in Celsius EC Solver with the new CDU object. This object allows for control of the temperature and flow rate of coolant provided to a cooling loop separate from the main facility coolant network. This cooling loop is typically used to deliver coolant to multiple IT equipment or Heat Exchangers are part of a liquid cooling strategy, and the heat rejected to it by these system components is in turn rejected to the facility coolant system. The CDU object allows for this heat to be rejected to the facility’s chilled water system or to cooling air delivered to the facility by air cooling units.

Dielectric layer objects, previously modeled as part of existing PCB models, can now be modeled as separate objects. This allows for more accurate modeling of electric conductivity across the PCB.

Group Obstructions can now be converted to Detailed Components. Components defined in MCAD files can easily be imported into the model. The conversion process attempts to preserve the structural hierarchy of the objects inside the group obstruction.

Bar units can now be used for defining pressures in property sheets, curves, push pins, and legends.

The position of the sun can now be specified with solar angles; solar azimuth and solar elevation, rather than unit vectors.

The new Replace Substrate checkbox in the package builder allows the choice between retaining a component’s existing substrate or replacing it with a new one. This allows the parts around the existing substrate to be defined.

Names are now displayed on the blocks of a power map and in the power map table for the Defined Power Blocks configuration. This allows for better visualization and definition of the power distribution across an object.

The modeling process for liquid-to-liquid cooling has been enhanced by introducing support for 2-port valves. This allows for more accurate modeling of facility coolant loops.

Three new package builder types have been added: fcBGA, fcCSP, and HI. This makes it easier to quickly create new components with desired parts such as lids, bumps, and encapsulant automatically added to the component model.

A new tool has been added to select the sides of a solid obstruction on which to add to a face object, eliminating the need to add all faces and manually remove faces that are not needed.

Python scripts can now be recorded and run within Celsius EC Solver for automated tasks.

The global axes can now be shown when exporting images from the Enhanced View. This option is also available when exporting images from reports.

Power maps are now compatible with Celsius™ Interchange Model (CIM) files; a power map for an object can be loaded from a CIM file. CIM files capture the behavior of power maps and their relationships to one another more accurately, as multiple power maps can be contained in a single file. This allows for a more seamless integration of power maps in Celsius EC Solver with other Cadence Celsius™ products and makes modeling and simulation more comprehensive.

Additionally, temperature-dependent power maps are now available as an option on Heat Source objects, making importing or creating multiple power maps on the object much easier.

Subassemblies are now included in the list of objects to scale powers to, allowing for greater power draw accuracy in the model.

The thickness and diameter properties of flow network pipes can now be inferred directly from pipe standard data sheets, such as those published by ASME. This provides a more streamlined modeling process for your flow network pipes, adhering to the geometry standards set out in the data sheets.

New properties related to time-dependent power have been added to the IT Equipment property sheet. This allows for transient analysis of power on IT equipment modeled as part of a flow network without having to rely on a 3D model.

The Display Result options have been expanded to include a new variable, Hydraulic Diameter. This plot makes it easier to comparatively visualize circular and rectangular pipes/ducts.

The modeling process for valves and joins on pipes and ducts has been simplified by introducing the option to define them and their associated properties on the same property sheet as the parent pipe/duct. This includes the ability to specify the characteristics of valves and their opening position. The fittings no longer have to be explicitly modeled in the flow network. However, their properties will still be accounted for and they will still appear in the Model Tree. This allows for easier modeling and definition of joins and valves, particularly if the latter are not fully open.

Several improvements have been made to the flow network view to simplify locating and editing objects on the canvas.

CAD parts can now be created directly in Celsius EC Solver. To do this, sketch them directly to a Sketch Plane object, which can now be added to the top-level project object.

It is now possible to split a CAD solid into two using a Sketch Plane and the new Split tool. Objects can easily be separated from a single solid and edited individually.

SPD package imports now automatically include the mold geometry, the outer casing of a package. This provides a more accurate representation of the component’s dimensions, making visualizing, planning, and designing easier than ever.

Electrical connections made using wire bonding are now supported when importing ECAD files as components into the software.

The integration between Celsius EC Solver and Celsius™ Interchange Model files has been significantly enhanced with various compatibility improvements when importing .cim files.

The material library used in other Sigrity products is now automatically imported into Celsius EC Solver as a separate library in the object panel.

Celsius™ Interchange Model Layout files can now be imported for Subcomponent objects.

You can now specify whether items are installed when optimizing cases in Optimality.

You can now submit jobs to an IBM® LSF Cluster on a Linux machine using a dedicated option in the Control Center.

Humidity calculations have been added to the Solution Control options in Celsius EC Solver and new options to specify boundary conditions on Vents and Environments have been added. The available humidity configurations for these objects include Relative Humidity, Wet Bulb Temperature, and Moisture Content.

Dimensions of a Grid Control object whose direction is set to Geometry-Based can now be edited. This allows you to manipulate grid generation around the geometry of the parent object, while restricting this to a particular 3D region of the object.

The CDU object from release 2025.0 has now been integrated into SovlerExchange, allowing the CDU to be more flexibly simulated by altering its physical properties when the solver is running. Celsius Electronics Cooling Features.

The size and shape of max/min markers on result planes can now be customized, enhancing result visualization for areas of high or low solution field values, such as temperature.

The Report functionality has been redesigned and enhanced to make it easier to create highly-customizable reports for Celsius models. Report text, images, and graphs can now be edited directly from within the Report Document view. Updates have also been made to the template functionality, the export options, and the customization of the look of the report (such as fonts and legends).

Network view objects can now be added to a report, allowing for greater coverage of model aspects. Currently-supported views include Flow Networks and Control Networks.

The Celsius Thermal Network workflow now integrates a Sweep Manager. The Sweep Manager can be used to set up and sweep different values of key parameters, such as power values and map files, heat transfer coefficient (HTC) values and map files, and inlet fluid temperatures and flow rates. This integration streamlines the process of analyzing and optimizing the thermal network performance, saving users time and effort.

A heat sink block can be added for a one-dimensional heat sink model that supports dynamic air flow rate (L/min). This new type of block is more comprehensive and precise than a CFD block. The block allows you to specify the airflow rate directly in the Celsius Thermal Network workflow, eliminating the need to rerun the CFD simulations.

A Python module file can be used to implement complex power-switching mechanisms, such as PID control analysis; and customize power switching rules for specific requirements. This file can be called with the PYTHON_MODULE_CONTROL statement in the Throttling_Control.txt file.

Using the Performance Metrics feature, you can compare and analyze the results of the reference design with the best optimized results. It helps you achieve the best possible optimized results in the design.

A new option, Additional Sampling Number, has been added in the Monte Carlo Parameter Table tab of the Optimality window. Using this option, additional samples can be generated during Monte Carlo analysis, improving the possibility of finding the desired results.

A new section, Roughness Library, has been added to the report. This section helps identify the snowball radius and surface roughness ratio applied in the design.

Two new buttons, Split Via and Merge Via, have been added to the Via Editing dialog box. The Split Via option allows you to separate interconnected vias into stacked vias by adding the non-functional pad to the design. Whereas, the Merge Via option allows you to combine multiple vias into a single block by removing the non-functional pad from the design.

A new list, Layer, has been added in the MCP Editor dialog box. This functionality is useful when a component spans across two layers. Using this list, you can select each layer of a component to easily match it with the corresponding subcircuit nodes.

A new method, Custom, has been added in the Edit Cutting Boundary dialog box to manually create a cutting polygon. This method helps you draw the cutting polygon quickly and precisely in the design area based on your requirements.

The following buttons are now added in the Build PowerTree dialog box:

• Create from Starting Component Settings File: Updates properties for the Starting Components and DC-DC/LDO components by importing the .csv file.
• Create from AMM Library: Creates the DC-DC/LDO component instances with the models defined in the AMM library.
• Export: Exports the Starting components and DC-DC/LDO components to a .csv file.
• Search from netlist: Opens the Netlist Information window. You can search for specific objects, such as Model, RefDes, Pin, Net, and Object Property in a design.

In Script IDE, you can now debug a Python script by setting breakpoints. This functionality lets you inspect the stack frames, evaluate the arbitrary Python code, and fix errors.

A new option, Zone Name, has been added in the View – Show menu. This option lets you quickly identify the zone name and its location in the design.

A new option, Default Layout, has been added in the Window menu. This option resets the position of the GUI elements, such as the pane and toolbar in the Layout Workbench window to the default.

A new icon, New Library, has been added on the Standard toolbar of the Analysis Model Manager window. Click it to add models to the library based on your requirements and save the library file in the .amm format.

The following TCL commands have been added to Sigrity:

• Splits a via on a plane or signal layer to improve signal integrity (sigrity::split via {Via_Name} {Layer_Name} -Plane -Signal {!})
• Merges the specified vias to improve signal integrity. (sigrity::merge via {Via_name1, Via_name2} {!})
• Adds components on the edge of a shape. The LeadFrame package (QFP/TSOP) lets you create a lead component on each metal lead and, in turn, improves the simulation setup flow. (sigrity::process CreateLeadframeComponent -layer {LayerName} -offset {double} [-EnabledNets])
• Sets the mode on the Net Manager pane. This command lets you display the different fields, and the columns associated with the selected mode on the Net Manager pane. (set NetManager -Mode {Coupling|Default|Voltage} {!})

GDS to SPD Translator leverages a new polygon method for boosting the net tracing process during translation. You can specify this option in the .option section of the configuration file.

GDS to SPD Translator provides the merge_short_nets option to prevent the merging of short nets present in a GDS file. If this option is set to 0, GDS to SPD translator does not merge the short nets and generates a shorts.log file containing all the short nets that exist in the design. If this option is set to 1, all the short nets are merged automatically with one of the net names. You can specify this option in the .option section of the configuration file.

In GDS to SPD Translator, you can specify the path to a label text file, which contains the label text information for the specified layers.

XtractIM lets you view the values of self-loop inductance, total loop inductance, resistance, and induced voltage on the design layout, thereby improving the visual experience. To view these values, select the Show Values check box. In addition, you can adjust the font size of the displayed values using the Font Size numeric text box.

In Clarity 3D Workbench, the simulation toolbar now includes three new postprocessing options to view the final mesh generated after the adaptive mesh refinement stage, the initial mesh after a simulation run, and the S-Parameter results in an external instance of Broadband SPICE.

Clarity 3D Workbench provides easy access to the multiple. R3D files generated after a parametric sweep simulation. You can now access these files from the Project panel by right-clicking the Field-Plot option under the Results subtree instead of loading them one by one in the postprocessing view.

To ensure protection of proprietary data, encryption of the material library file is now supported. During encryption, the contents of the material library file are encoded into a format that cannot be read or modified without proper decryption. When you load an encrypted material file in the Material Manager window, only the material names are displayed, and the material details are hidden.

The Cut and Stitch flow in Clarity 3D Layout has been enhanced as follows:

• The Cut and Stitch Options menu in the Options dialog box now includes only the wave port options.
• A new option, Extrude and Reference Plane Shift Distance, has been added on the Cut and Stitch Options menu that lets you extrude and shift the wave port reference plane by a specified distance. This option helps minimize the discontinuity effect at the cutting edge.

In Clarity 3D Layout, the Optimality Intelligence System Explorer provides two new optimization templates, XHatch template and Component-based template, for generating parameters automatically:

• X-Hatch: Use this template to parameterize the border width, line width, spacing, and angle of the selected X-Hatch geometry.
• Component based template – Use this template to extract the trace width, via size, pad size, and void size. You can also use the template to generate pin pad voids for all the enabled nets.

The Optimality Intelligence System Explorer in Clarity 3D Layout supports importing AMM library models to the Component Manager for optimization.

• Clarity 3D Layout Capacitance Extraction workflow lets you plot the charge density and electric field (Er) results in the postprocessing view.
• Clarity 3D Layout Inductance Extraction workflow now includes the capability to save one or more curves to a file (.ind extension) for comparison in the R/L/C/G vs Freq plot in the postprocessing view.

To ensure protection of proprietary data, Clarity 3D Transient Solver now supports encryption of the material library file. For encrypting the contents of your material library file, save the file as an encrypted material file (.cmxx). After encryption, the contents of the material library file are encoded into a format that cannot be read or modified without proper decryption. When you load an encrypted material file in the Material Manager window, only the material names are displayed and the material details are hidden.

To ensure protection of proprietary data, encryption of the material library file is now supported. During encryption, the contents of the material library file are encoded into a format that cannot be read or modified without proper decryption. When you load an encrypted material file in the Material Manager window, only the material names are displayed, and the material details are hidden.

When importing a power map file in Celsius Layout, you can preview the device names and their outlines to ensure that the correct devices are mapped. The Devices Selection button in the preview pane lists all the available devices. After you select the device name that you want to preview, the preview pane gets updated with the device name and its outline information.

In Celsius Layout, when manually defining boundary conditions, you can add a boundary condition, such as Heat Transfer Coefficient (HTC) as a parameter for optimization. The Add Optimization Parameter option has been added to the Setup Boundary Conditions tab to support this.

In Celsius Layout, e-results, such as IR-drop, current density, and resistance can be assigned as function parameters for optimality studies. You can add resistance as a function parameter when configuring the resistance measurement settings in the Resistance Measurement Generation workflow. Similarly, other e-results can be added as function parameters while setting up VRMs and Sinks in the E-T Co-Simulation workflows.

After running an optimality study in Celsius 3D Workbench, you can directly view the field plot or summary result for each iteration using the Load Field-Plot or Load Summary Result context-menu options.

The Thermal Simulation workflows in Celsius 3DIC have been significantly enhanced. Key improvements include:

• Advanced Power Setup with Transient Power Function and Multi-Mode options
• Enhanced GUI for the Mesh Control and Simulation Control tabs
• Improved meshing capabilities
• Celsius Interchange Model (.cim) generation
• Material library support for block and connections
• Import of Heat Transfer Coefficients (HTCs) from a CFD file
• Bump creation through the Bump Array Wizard
• Layer Stackup CSV file generation

The Warpage and Stress workflow in Celsius 3DIC has undergone significant improvements, such as:

• Improved multi-stage warpage simulation flow for 3DIC packaging process
• Enhanced GUI for the Mesh Control, Simulation Control, and Stress Boundary Conditions tabs
• Support for large deformations and temperature profiles
• Bump creation through the Bump Array Wizard
• New constraint types
• Enhanced meshing capabilities

A new option, Scripting Pane, has been added to the View – Pane menu. When this option is selected, the Tcl Command or Python Command pane is displayed based on the option that you select in the General page of the Options dialog box.

A new icon, 3D, has been added to the 2D/3D View toolbar, which displays the 3D view of the selected portion of the design in the 3D View tab.

A new option, Detect Xhatch, has been added to the Edit – Shape menu. This option lets you extract accurate information about the Xhatch geometry in the design.

The design menus in the improved user interface of the Layout Workbench have been rearranged for better accessibility. In addition to the standard menus, which includes File, View, Tools, and Help, a new Window menu has been added.

Similar to PowerDC, a new column, Resistance (Ohm), has been added to the Edit Sinks tab. This column displays the resistance value corresponding to each pin that is associated with a sink for smoother interoperability between PowerTree™ and PowerDC™.

The Edit Cutting Boundary dialog box has been enhanced as follows:

• The Cut Outside column has been renamed to Retain. It now contains two options, Inside and Outside, that let you to retain the inside or outside portion of the cut design when the cutting operation is performed.
• A new column, Method, has been added that lets you to select the cut method. Possible values are: Conformal (default), Rectangle, and 45 Degree.

The following toolbar icons related to geometry cutting are now available in the Edit Cutting Boundary dialog box for ease of use:

• Add Rectangle
• Add Cutting Polygon
• Add Cutting Polygon (by Enabled Nets)
• Insert Cutting Polygon Vertex
• Delete Cutting Polygon Vertex
• Show Cutting Polygon

Layout Workbench now has the Display Color Editor functionality available in the MCP Auto Connection window, which lets you to assign a color for pin matching. This functionality helps you easily identify the matching pins in the left and right sections of the MCP Auto Connection window.

A new option, Remove slender hole during shape processing, has been added to the Processing page of the Options dialog box. This option lets you remove the geometry errors in the design.

A new option, Use current for the DC-DC/LDO input pins, has been added to the Starting Components dialog box. This option enables the Current (A) column and lets you specify the current value corresponding to the input pins. If this option is deselected, the convert rate is used instead. This feature provides smoother interoperability between PowerTree and Analysis Model Manager™.

New Tcl commands have been added to identify the slender holes and returns the total number of negative shapes found in the design (sigrity::check SlenderHole {threshold}) and to remove the slender holes from the design (sigrity::sanitizelayout RemoveSlenderHole {threshold}).

A new option, Unlink invalid node from port terminals, has been added in the Sanitize Layout dialog box. This option lets you unlink the invalid or floating nodes from the port terminals in a design. The node is considered invalid when there is no connection to enable the circuit terminal or has no contact with the metal layer.

When you select the Basic Mode or Enhanced Mode option in the Inter-plane coupling (IPC) section in the Field Domain page of the Options dialog box, PowerSI automatically distributes the simulation on a single computer or across multiple computers to help run the simulation faster.

A new functionality, Channel Check Optimization, has been added in the S-Parameter Assessment workflow. It uses the AI-driven Multidisciplinary Analysis and Optimization (MDAO) technology that lets you optimize your design quickly and efficiently without losing any accuracy.

A new option, Monte Carlo Method, has been added in the Optimality dialog box. This option lets you create multiple random samples to depict variations in input parameters and assess the output.

Broadband SPICE lets you run Python scripts directly from the command line for performing simulation and analysis. The new -py and *.py options make it easier to integrate Python scripts with the command-line operations. This update streamlines the process of automating and customizing simulations from the command line, which makes your simulation tasks faster and easier.

New Tcl command added to calculate the dynamic model using the specified DC-bias voltage and temperature. (sigrity::do CalculateDynamicModel -inputpath {path_name} -outputpath {path_name} -dcbias {value} -Temp {temp_value})

Models TSVBump with the R-element and L-element, or only with the R-element. It gives you more options for accurate TSVBump modeling based on your needs. (xpi_tsv_bump_L [(“1|0”)|(“yes”|”no”)] [-h)

The Skip DC_R of Each Path and Only DC_R of Each Path options have been added to the Setup menu.

• Skip DC_R of Each Path: Use this option to skip the calculation of the DC-R result during the simulation.
• Only DC_R of Each Path: Use this option to calculate the DC-R result only during the simulation.

The MCP Auto Connection window includes the Display Color Editor, which lets you assign a color for pin matching. It helps you easily identify the matching pins in the left and right sections of the MCP Auto Connection window.

The Save each simulation individually check box has been added to the Tools – Options – Edit Options – Simulation (Basic) – General form. Select this check box and run the simulation to generate a simulation results folder containing files and logs with a timestamp for each simulation.

The XtractIM setup check box lets you import an existing package setup to reuse the configurations and settings from one .spd file to another.

A new option, Use Improved User Interface, has been added in the Themes page of the Options dialog box in the Layout Workbench GUI. In the new GUI, the toolbar icons and menu options have been enhanced and rearranged.

Gds2Spd Translator supports exporting a sample technology file before running the translation process. After specifying the filename and path for the technology file (.tech) in the Output Tech File dialog box, you can click the Export button and create and save the corresponding technology file locally.

Gds2Spd Translator lets you export the text labels added to the nets in a text file by clicking the Export Labels button under the Text Labels tab in the Gds2Spd Translator Settings form. This capability allows you to reuse any manually added labels by loading the exported text file.

The Enable Multi-threaded Matrix Solver check box has been added that lets you accelerate the simulation speed for high-performance computing. This check box provides two options, Automatic and Always, to include the -lhpc4 or -lhpc5 parameter, respectively, in the SPEEDEM Simulator (SPDSIM) before running the simulation.

The Error Checking page of the Options dialog box has a new checkbox labeled Node Contact. When checked, it identifies whether a node is connected to a shape in the layout.

Clarity 3D Workbench now includes a new component library that lets you use predefined 3D component templates or add existing 3D components to create 3D designs and simulation models.

Clarity 3D Workbench now support an AI-powered capability for searching the content and displaying relevant information.

Clarity 3D Workbench supports writing expressions or equations containing undefined parameters in the Property window to describe a simulation variable. The improved expression parser automatically detects any undefined parameter in an expression and prompts users to specify their values. This capability lets you define a model or a simulation variable as a function instead of specifying static values.

A new option, Connect mask layer splits by vertical walls, has been added to Clarity 3D Workbench. This option connects the splits of EMI shielding layer or other metal mask layers that occur due to the varying heights of these layers when they cross multizones. In Clarity 3D Workbench, this option has been added to the File – Translator page of the Options dialog box.

This Clarity 3D Layout workflow integrates Allegro PCB Designer with Clarity 3D Layout for high-speed structure optimization.

This Clarity 3D Layout editor lets you set up ports, solder bumps/balls/extrusions, and two-terminal and multi-terminal circuits using a single GUI.

The Coaxial Open Port option lets you create ports for each target net pin and reference net pin in Clarity 3D Layout. The nearby reference net pins are then used as a reference for each target net pin, reducing the number of ports needed. In addition, the ports of unused reference net pins are shorted to the ground.

Two new options, Parametric Import and Default Import, have been added to the Tools – Launch Clarity3DWorkbench menu. The Parametric Import option lets you import the design along with its parameters into Clarity 3D Workbench. The Default Import option lets you ignore the parameters when importing the design into Clarity 3D Workbench.

The Clarity 3D Layout Inductance Extraction Workflow includes the following enhancements:

• A new text box, Find RefDes by Name, is added to filter the required RefDes names from the list.
• You can now use the key on the keyboard to select multiple RefDes names. In addition, you can use + A on the keyboard to select all RefDes names from the list.
• If you select a source or sink, it now gets highlighted on the layout canvas with a rectangular boundary with the source name. In addition, all the nodes in the source are also highlighted. You can also select one or more nodes to highlight them on the layout canvas.
• You can now export the RLCG data to an Excel file in both Clarity 3D Layout and Clarity 3D Workbench.

The Edit Cutting Boundary dialog box has been enhanced as follows:

• The Cut Outside column has been renamed to Retain. It now contains two options, Inside and Outside, that allow you to retain the inside or outside portion of the cut design when the cutting operation is performed.
• A new column, Method, has been added that lets you to select the cut method. Possible values are: Conformal (default), Rectangle, and 45 Degree.

The following toolbar icons related to geometry cutting are now available in the Edit Cutting Boundary dialog box for ease of use:

• Add Rectangle
• Add Cutting Polygon
• Add Cutting Polygon (by Enabled Nets)
• Insert Cutting Polygon Vertex
• Delete Cutting Polygon Vertex
• Show Cutting Polygon

The following enhancements have been made in the Intelligent Multi-Block Extraction with HPC flow:

• Support to import .spd, .mcm, and .sip format files has been added. In case of .mcm and .sip files, an additional Translator Net Selection dialog box is displayed.
• Two new context-menu options, Add Block and Add Block Script have been added. The Add Block option lets you add additional block files in .mdd and .spd format. The Add Block Script option lets you perform multiple operations on one or more blocks using a Tcl or Python script.
• The Additional Script field now lets you apply the Python or Tcl script to individual blocks.
• Two new options, 2D View and 3D View, have been added that let you view the 2D and 3D view of the designs

You can now distribute a simulation run to multiple Windows machines that lie on the same network for faster simulation time and speed. Now, in addition to the Local option under Disable Remote Simulation, you can select the SSH and Server farm options to distribute the simulation to multiple Windows machines.

A new option, Connect mask layer splits by vertical walls, has been added to Clarity 3D Layout. This option connects the splits of EMI shielding layer or other metal mask layers that occur due to the varying heights of these layers when they cross multizones.

The table summary log file (_table_summary.log), which is generated after the simulation is complete, has been updated to include three new columns described below:

• Waiting Resource: Indicates the time taken to wait for the resource before the initial meshing stage.
• Total Simulation Time: Indicates the total time for the initial mesh, adaptive mesh, and frequency sweep processing.
• Total Wall Time: Indicates the total simulation time including the resource waiting time.

Clarity 3D Transient Solver leverages a new meshing algorithm that enhances overall mesh processing, specifically for large designs and use cases. The new algorithm dramatically improves the mesh quality, minimum mesh size, number of mesh key points, total mesh number, and memory usage.

The material processing capability has been enhanced to handle thin outer metal, which previously resulted in open and short issues in some designs. In addition, the material processing engine offers improved mode extraction for particular use cases, including waveguide and coaxial designs.

The solver engine now uses a new analytical calculation method to calculate the characteristic impedance of coaxial designs with improved accuracy.

Clarity 3D Transient Solver now supports an AI-powered capability for searching content and displaying relevant information. The Search Documents pane lets you specify and search a query and display the related search results in a browser-like panel.

The solver engine has been optimized to support both Nvidia and AMD GPUs. Use the GPU type drop-down menu in the Set up Computer Resources dialog to select Nvidia or AMD as the GPU type.

A new option, Connect mask layer splits by vertical walls, has been added to the File – Translator page of the Options dialog box. This option connects the splits of EMI shielding layer or other metal mask layers that occur due to the varying heights of these layers when they cross multi zones.

Clarity 3D Transient Solver support writing expressions or equations containing undefined parameters in the Property window to describe a simulation variable. The improved expression parser automatically detects any undefined parameter in an expression and prompts users to specify their values. This capability lets you define a model or a simulation variable as a function instead of specifying static values.

The following enhancements have been made to the GUI:

1. The Tools menu includes a new option called Configure JedAI, which opens the Configure JedAI dialog box upon clicking.
2. The Threads field in the Set up Computer Resources dialog box has been replaced with a new GPU type field.
3. An option named Simulation Options, which was previously found under the Tools menu has been moved to the Solver menu under Analysis Setup – Simulation Options.
4. The Simulation Options dialog box has been updated to include Configuration, Mesh Options, and Starter Options pages to set up additional simulation-related options.
5. The Simulate dialog box has been reorganized because material output, preprocessing optimization, and runtime parallelization settings have been removed from this dialog box.

A new unified GUI platform is now available for Clarity 3D Workbench, Celsius Thermal Solver, and Clarity 3D Transient Solver tools. You can now access these tools from a single GUI, and also easily switch from one tool to another without the need to open the tool separately.

The Rigid-Flex Editing Capability now includes:

• The Add Zone button in the Zone Manager pane for adding additional zones. To add a zone, click the button and draw a rectangle around the desired area to define the zone.
• The Edit Outline button to modify the zone.
• The Add Bend button in the Flex Bending pane to add a new bend. To add a bend, click the button and draw a line to connect the design outlines in the desired area.
• The Edit Bend button to modify the bend.
• The Check Bend button to check for bend-related issues in the rigid-flex design.

Celsius Studio now supports Celsius Interchange Model generation, which is a 3D model derived from detailed physical designs for multi-physics and multi-scale analysis. This Celsius Interchange Model file (.cim) serves as a design information carrier across Celsius Studio tools, enabling a variety of simulation and analysis tasks.

Large deformation analysis is now supported in warpage and stress studies. This study uses the Total Lagrangian approach to model geometric nonlinearities in simulation, which allows accurate prediction of final deformations.

In the solid extraction flow in Celsius 3D Workbench, you can now import area-based power map files to create terminals. For designs with multiple blocks, this capability allows automatic terminal creation, eliminating the need to manually create and set up 2D sheets individually. Additionally, thermal throttling feature is now supported in Celsius Thermal Network. This makes it ideal for preliminary analyses or when a quick estimation is required. It runs significantly faster than 3D models, allowing for quicker iterations and more efficient decision-making.

The Monte Carlo Method GUI in the Optimality Intelligent System Explorer has a separate Monte Carlo Parameter Table to select the parameters that need to be studied. The sampling methods available for Monte Carlo Method are Latin Hypercube and Low-Discrepancy Sequence.

During post-processing of field results, you can place multiple probe points to capture the result variations across different areas of the design. These probe points can be placed as a part of probe point groups.

In solid extraction flow, you can import area-based power map files to create terminals. For designs with multiple blocks, this capability lets you import an existing power map file instead of manually creating and setting up 2D sheets individually.

In the solid extraction flow in Celsius 3D Workbench, you can now import area-based power map files to create terminals. For designs with multiple blocks, this capability allows automatic terminal creation, eliminating the need to manually create and set up 2D sheets individually. Additionally, the thermal throttling feature is now supported in Celsius Thermal Network. This makes it ideal for preliminary analyses or when a quick estimation is required. It runs significantly faster than 3D models, allowing for quicker iterations and more efficient decision-making.

For ease of organization, Celsius 3D Workbench lets you rename multiple design parts simultaneously. This is especially useful for complex designs that require managing a large number of parts within an assembly.

When importing the simplified model (._Simplified.xml) or Celsius Interchange Model (.cim) file of a large hierarchical design database, you can keep the original design hierarchy by using new Group by Original Design Hierarchy option. This is especially useful for complex designs that require managing a large number of parts.

You can parameterize the structural properties of materials, such as CTE, which can then be used in parameter sweep studies.

Celsius 3D Workbench supports an AI-powered capability for searching the content and displaying relevant information. The Search Documents pane lets you enter and search a query, and display related search results in a browser-like panel.

Celsius 3D Workbench includes the Mesh Plot option for post-simulation analysis. Using this option, you can display the mesh plot to visually inspect the mesh structure, identify potential issues, and make informed decisions to enhance the accuracy of the simulation.

Instead of importing bump model files from external sources, you can create bump models within Celsius 3DIC using the Bump Array Wizard. This lets you control the bump configuration as per your design.

In Transient Thermal workflow in Celsius 3DIC, you can use Transient Power Func and Multi-Mode options for setting up the power dissipation. These options let you use a transient power function curve or a multi-power file as the power input.

The Mesh Control tab in the Simulation Setup has been enhanced to provide better control over block modeling and connection modeling, resulting in a finer, more refined mesh. Additionally, the Simulation Control tab GUI has been updated and the Connection Modeling Control section has been moved to the Mesh Control tab.

You can view and change the material information for the blocks (2d pwr and 3d pwr blocks) and connections used in the design within the Component Model GUI.

When using 2d pwr as the Model Type, you can create the Layer Stackup CSV file within the GUI. This .csv file defines the layer stackup structure and material assignment from the block material design library. It also defines the power layer. After the creation of the Layer Stackup CSV file, it is automatically assigned in the metal density file entry.

You can import an existing CFD model file and apply its heat transfer coefficients to the external surfaces of your design. This CFD file contains the heat transfer coefficient and ambient temperature values for each terminal.

The Set up Temperature Profile option has been added in the Stress Simulation workflow, which lets you use a transient temperature function for the warpage and stress analysis.

In the Stress Simulation workflow, the Stress Boundary Conditions tab has been enhanced with new constraint types to help you accurately simulate the behavior of materials under mechanical or thermal loads.

It is now possible to import into the software reduced order models (STN files) that were created in Celsius 3D. These models can be solved using both the steady-state and transient simulations.

It is now possible to group together similar vias when importing electronic CAD files. Each group of vias is mapped to a single via object. This significantly improves the loading performance of the model. The locations of the vias in each group are still retained for use by the solver.

PowerDC supports the BPA file format. The BPA file is a current assignment file that defines the total current of a power grid cell, which is then equally distributed across the power pins within the cell. This provides better control over power distribution.

You can select multiple result sinks from the Current-Limited IR Drop flow and run IR Drop analysis for them sequentially, instead of running them one by one. To do so, select Run IR drop analysis for the selected worst case in the Results and Report -> Worst IR Drop form.

PowerDC supports mixing different conversion devices, such as switching regulators and linear regulators, within a single DC-DC/LDO instance. This enhancement offers added flexibility by letting you configure each instance in your design according to your specific needs.

In the PowerDC Multi-Board Current-Limited IR Drop workflow, a new feature has been introduced to improve user experience by enabling IR Drop simulations for specific cases. You can select a specific case from the generated results to run the IR Drop analysis for the selected worst case directly within the Multi-Board workflow.

The PowerDC Resistance Measurement flow has been enhanced to automatically flag DC-R constraints, providing you with more precise information during resistance analysis. A new column, DC-R Spec (Ohm), has been added to the Resistance Analysis Setup -> Set up Resistance Measurements form. This column lets you specify the maximum allowable resistance value for each measurement.

You can specify a minimum current value for each sink during the sink setting up. This ensures that the integrated circuits (ICs) get a minimum current to function correctly. A new column Min Current has been added to the Set up Sinks form. The default value for the Min Current column is set to 0A.

New Tcl commands have been added:

• Specifies the details of sinks and VRMs in PowerDC. You can select multiple elements at the same time, and get detailed information about power nets, ground nets, nodes, and other relevant parameters. (sigrity::querydetails pdcelem -name {name1} {name2}…)
• Specifies a minimum current value for each sink during the sink setting up to ensure that the integrated circuits (ICs) get a minimum current to function correctly. (sigrity::update pdcElem {sink_name} -mincurrent {current_value} {!})
• Imports the BPA file into PowerDC. The BPA file is a current assignment file that defines the total current of a power grid cell, which is then equally distributed across the power pins within the cell. This provides better control over power distribution. (sigrity::add pdcSink -import -file {file_path} {!})

When viewing field plots during post processing in Celsius 3D Workbench and Celsius 3DIC, use the Show Outline and Hide Outline context menu options to display or hide design component names in the 3D Modeler window. This is especially useful for complex designs with a large number of parts.

Celsius Layout and Celsius 3DIC now support the area-based power map files with device names and coordinates. The device definition section in the power map file includes the device name ant its lower-left and upper-right coordinates.

When postprocessing field results, you can now group the parts progressively based on multiple attributes. Each grouping refines the previous one. In the Parts Selector window, once a block is grouped using one criterion, another criterion can be added to its subnodes. This allows components to be filtered and organized based on multiple criteria.

To ensure protection of proprietary data, Celsius 3D Workbench now supports encryption of the material library file. To encrypt the contents of the material library file, save the file as an Encrypted Material File (…cmxx). After encryption, the contents of the material library file are encoded into a format that cannot be read or modified without proper decryption. When an encrypted file is loaded in the Material Manager window, only the material names are displayed and the material details are hidden.

Celsius 3D Workbench now supports the Kinematic Hardening model for defining the plasticity of materials. In Kinematic Hardening, the yield surface shifts or moves in response to applied stress. You can define the material properties for Kinematic Hardening in the Structural tab of the Material Manager window.

When manually defining a boundary condition, you can add a boundary condition, such as Heat Transfer Coefficient (HTC), as a parameter for optimization. The Add Optimization Parameter option has been added to the Set up Boundary Conditions tab to support this.

You can now define the thermal contact resistance between two different surfaces (solid to solid) for accurate thermal simulation. Specify the thermal contact resistance at the top and bottom surface in the Thermal Contact Resistance tab of the Layer Manager form.

An auxiliary variable, Store Cell Power, has been added to Solution Control. When selected, two new plot types, Cell Power and Cell Power Density, are available to be plotted on a result plane.

Sigrity Advanced Package eXtractor is a new technology that has been introduced in this release. It lets you create RLGC or SPICE IC package electrical models with greater accuracy and is up to ten times faster than other approaches. This is made possible through the use of Cadence advanced package simulation technology. The compact models derived from these solvers in Advanced Package eXtractor allow you to perform system-level signal and power integrity simulations, including drivers, receivers, and interconnects.

Passivity mode IV has been added to Broadband SPICE, and you can select the Passivity mode IV option in Extraction settings in the Options form. This mode supports the BBS extraction engine. It employs an advanced vector fitting and passivity enforcement method that helps in getting an accurate fitted model in BBS engine for S-parameters with complex low frequency behaviors.

A new workflow, Multi-Board Current-Limited IR Drop Analysis, has been added to PowerDC. It will help you in performing current-limited IR drop analysis for multiple boards.

To group distribution plot results by net, select the One plot for each power and one plot for ground check box in the Options form. This would help you in checking for hot/cold spots in your report.

Measure the resistance of only power or ground nets from one component to another. Select one of the resistance network topologies out of Lumped to Lumped (Partial/Loop), Lumped to Multiple (Partial/Loop), Multiple to Lumped (Partial/Loop), and Multiple to Multiple (Partial/Loop) in the Set up Resistance Measurements wizard.

Open each layout block in a separate window now and also, up to three windows can be opened simultaneously. Modify the design setup and view results in these windows. Right-click on a block and select Load in New Window to open a new window.

In PowerSI, you can now use the Clarity 3D-IE solver feature to generate accurate simulation results while creating cutting polygons for parallel tab traces.

To comply with HPC regulations, all the workflows in SPEEDEM will utilize Generation II licenses to expedite the simulation process. To do so, a new workflow item named Set up Computer Resources has been added to the Simulation schema.

Two new options, Port and Probe, have been added under Output Setup in the workflow pane. Select these options to specify the port or probe settings of your circuit.

Perform various operations such as loading settings from the log file, modifying the file path for the layer map file, and so on, on the GDS files before loading them in XcitePI. This will allow easier file opening in XcitePI, which is more consistent with the Gds to Spd Translator.

Three new options: Distributed, Non-Distributed, option ‘1’, and Non-Distributed, option ‘2’ have been added to the Decap form. These options lets you choose the decap distribution in the output result model.

Three new options: R only, RC only, and All (RLCK) have been added to the Spice Netlist form. These options lets you choose the elements to extract into the SPICE output model file.

Use Python commands to automate tasks in the Layout Workbench tools. Python is a simple and easy-to-use platform and provides Layout Workbench functions for even those tasks that are not possible to do using Tcl. A new pane, Python Command, has been added for this.

A new option, Degassing Holes, has been added to the View – Show menu of all the Layout Workbench tools. When this option is selected, the degassing holes are highlighted, which lets you distinguish them from the other voids in the 2D view.

A new option, Edit Cross-Hatch Plane Library, has been added in the Trace Editor tab. This option helps you evaluate the propagation constant and impedance accurately during the pre-layout stage of rigid-flex design.

While creating a library in PowerTree, the input and output pins related to DC-DC/LDO components are now automatically populated in the DC-DC/LDO Model tab. This helps save the time and effort to manually add the pins in the AMM library.

Once a layer is deleted from the Stack Up window, the corresponding component attached with the layer is automatically deleted from the Component Manager pane. This eliminates the need for any kind of manual intervention and makes the process much simpler.

A new check box, Enforce Causality, has been added in the Stack Up dialog box. This option lets you apply a causal single-pole Debye model with an extremely high resonance frequency during the simulation.

A new option, Reuse Ports, has been added to the File menu. You can use this option to import and reuse the ports in OptimizePI from the SPD file that is generated from PowerSI. This option helps you reuse the selected port as VRM, impedance observations, or decap from PowerSI, which, in turn, saves time.

A new option, Define PKG Models, has been added in the Post-Layout Analysis workflow pane. This option helps you define PKG models for different power domains. Moreover, this feature lets you use third-party model files when defining the Two-port Sparameter or Three-terminal SPICE model instead of using the Cadence generated models with MCP header.

DCR of the connector is calculated by dividing the average voltage IR drop by the total current. This information is mentioned in the DC analysis block diagram results.

A new option, Consider open CPW in calculating impedance, has been added in the Set up ERC Sim Options form. This option helps you search and calculate the impedance of open Coplanar Waveguide (CPW). In addition, it provides more accurate impedance of open CPWs.

A new button, Show Port, has been added in the Layer Selection pane of the Model Extraction workflow. This functionality helps you show or hide the ports in the 2D view as per your requirements.

A new option, Merge DC+Normal data, has been added in the context menu of the Network Display tab. This option helps you merge the DC and AC S-parameters to generate the required output and save the result in the BNP or TouchStone format.

A new option, Edit Cutting Clarity Block, has been added in the Model Extraction workflow. Using the Clarity 3D-IE solver feature, you can now generate the accurate simulation results while creating cutting polygon for parallel tab traces.

A new option, Geometry error, has been added in the Error Checking page of the Options form. This option lets you detect issues, such as Shape Gap, Slender Hole, Via Overlap, Node Contact, and Shape Thin Edge, in the design.

A new option, Snap, has been added in the context menu of 2D View after you add the shapes, such as Box, Circle, Polygon, or Cutting Polygon. Using this option, you can snap shapes, to the nearest Node, Pin, Vertex, and Via. It lets you modify the design more precisely and conveniently.

Two new views, VSWR and Active Parameter, have been added in the Network Display tab. The VSWR view displays the ratio between the maximum and minimum amplitudes of the corresponding field components on a transmission line. Whereas, the Active Parameter view shows the reflection coefficients at each port when other ports are excited.

Gds2Spd Translator supports an advanced via clustering capability that merges all the vias positioned close to each other in your design into a single large via. This capability leverages an advanced algorithm for clustering the vias that are in proximity.

Gds2Spd Translator supports designs with Through Silicon Via (TSV) structures. You can set the TSV options inside the .tsv section of the configuration file (.tech) to configure TSV structures.

Gds2Spd Translator now supports recognizing and handling degassing holes in a design. To apply this feature, set the degas_hole option to 1 and specify the degas_hole_num_limit option as the limit. Holes having the same pattern are recognized as degassing holes if their total count exceeds the number specified in the degas_hole_num_limit option. By default, degas_hole_num_limit is set to 10.