Any Technology. Any Process.
Cadence APD+ leads the industry with the most comprehensive support for the latest packaging techologies. Design with confidence knowing APD has been proven on countless designs even at the most advanced nodes.
Mechanical interfaces and advanced wirebonding
2D & 3D DRC checking. All-angle/radial routing
Flip Chip BGA
High capacity HDI structures & routing
ChipScale Package (CSP)
Die stacking, HDI structures & routing
Fan-in WLP (WLCSP)
Merged IC & package layout with GDSII output
Fan-Out WLP (FOWLP)
Advanced outgassing with GDSII output
Package on Package (PoP)
3D visualization & DRC, Auto signal assignment
Virtuoso integration, Parametrized structures
When You Need More Than Moore
The laws of physics are just one barrier straining the viability and effectiveness of Moores law. New system in package (SiP) technologies such as silicon interposers, 3D-IC, stacked die, etc are enabling companies to achieve the performance, cost, and schedule requirements they need without trying to re-write the physics textbook.