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WEBINAR

High Density Interconnect – Addressing Complex and Dense PCB Designs

Duration: 37:48

With device packages becoming smaller and smaller while the performance needs are increasing simultaneously, PCB designs have become more complex and dense than ever. The more complex a PCB becomes, the more challenges encountered resulting in a need to strategically plan ahead how you want your design to look. Join us to learn ways to overcome common challenges to optimize your next design with high density interconnect.

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WEBINAR

High Density Interconnect – Addressing Complex and Dense PCB Designs

With device packages becoming smaller and smaller while the performance needs are increasing simultaneously, PCB designs have become more complex and dense than ever. The more complex a PCB becomes, the more challenges encountered resulting in a need to strategically plan ahead how you want your design to look. Join us to learn ways to overcome common challenges to optimize your next design with high density interconnect.

Duration: 37:48

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