Celsius Thermal Solver

Accurately analyze interrelated electrical-thermal effects with electrical thermal co-simulation in Celsius. By including accurate stack-up materials, supplying the required currents with VRMs, and specifying the physical properties and transient inputs of components, accurate electrical and thermal measurements can be examined and PCBs can be adjusted during the design process.

Analyze the temperature distribution and thermal behavior of the design to predict the system behavior in a state of thermal equilibrium. Easily simulate for thermal, electrical, and warpage and stress as well as incorporate the effects of joule heating to produce a realistic representation of thermal behavior on the PCB and improve reliability. Analyze IR Drop dynamically and monitor the temperature distribution and thermal status of the system as a function of time to ensure reliability and efficient power with animated results of the temperature fluctuation at every time step.

Object-based meshing adapts the mesh to ensure accurate analysis of each device in the design. Easily define rules to provide meshing guidance and ensure individual objects are simulated accurately.

Perform fluid flow convection, conduction, and radiation heat transfer analysis with the powerful computational fluid dynamics (CFD) engine in Celsius. Easily visualize air flow and the effects of heat transfer in and around your system with CFD analysis.

Celsius models are built using a collection of over 100 intelligent objects designed specifically for electronics devices including PCBs, heat sinks, cold plate fans, enclosures, heat pipes, and more. For additional models, easily import complex MCAD models from Creo Parametric, SOLIDWORKS, and CATIA for analysis without simplification. Import PCB designs using the ODB++ or IPC2581 to preserve conductor layers, vias, and component sizes and positions for an accurate, detailed analysis.

Celsius includes both 2.5D and 3D Finite Element Analysis (FEA) solvers for comprehensive analysis regardless of design complexity. The 2.5D FEA solver quickly and accurately simulates thermal conduction in 3D planar layered structures, such as packages and PCBs with multiple layers and interconnect vias. The 3D FEA solver provides accurate thermal conduction analysis and electrical simulation for arbitrary 3D structures, such as complicated packages with bumps or bonding wires, connectors, and transitions of connectors to the PCB.

The innovative massive parallel solver technology included in Celsius accelerates simulation speeds up to 10 times compared to conventional thermal simulators and significantly reduces memory usage.