Celsius Thermal Solver

Comprehensive Power and Thermal Analysis

Why Celsius?

Optimize thermal performance and power integrity of the entire system design with Celsius. Efficiently analyze heat transfer with a powerful Finite Element Analysis (FEA) solver, perform CFD analysis, and obtain accurate temperature measurements of chips, packages, and PCBs to identify and correct thermal issues during the design process.

Key Benefits

  • Fast and Accurate System-Level Simulations
  • Identify Hot Spots and Thermal Stress
  • Improve Design Reliability
  • Thermal Analysis Designed for Electrical and Mechanical Engineers

Key Features

See how Celsius Thermal Solver can benefit your design flow

Electrical/Thermal Co-Simulation

Accurately analyze interrelated electrical-thermal effects with electrical thermal co-simulation in Celsius. By including accurate stack-up materials, supplying the required currents with VRMs, and specifying the physical properties and transient inputs of components, accurate electrical and thermal measurements can be examined and PCBs can be adjusted during the design process.

Electrical/Thermal Co-Simulation

Accurately analyze interrelated electrical-thermal effects with electrical thermal co-simulation in Celsius. By including accurate stack-up materials, supplying the required currents with VRMs, and specifying the physical properties and transient inputs of components, accurate electrical and thermal measurements can be examined and PCBs can be adjusted during the design process.

Dynamic IR Drop Analysis

Analyze the temperature distribution and thermal behavior of the design to predict the system behavior in a state of thermal equilibrium. Easily simulate for thermal, electrical, and warpage and stress as well as incorporate the effects of joule heating to produce a realistic representation of thermal behavior on the PCB and improve reliability. Analyze IR Drop dynamically and monitor the temperature distribution and thermal status of the system as a function of time to ensure reliability and efficient power with animated results of the temperature fluctuation at every time step.
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Dynamic IR Drop Analysis

Analyze the temperature distribution and thermal behavior of the design to predict the system behavior in a state of thermal equilibrium. Easily simulate for thermal, electrical, and warpage and stress as well as incorporate the effects of joule heating to produce a realistic representation of thermal behavior on the PCB and improve reliability. Analyze IR Drop dynamically and monitor the temperature distribution and thermal status of the system as a function of time to ensure reliability and efficient power with animated results of the temperature fluctuation at every time step.
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Automatic Object-Based Mesh Generation

Object-based meshing adapts the mesh to ensure accurate analysis of each device in the design. Easily define rules to provide meshing guidance and ensure individual objects are simulated accurately.

Automatic Object-Based Mesh Generation

Object-based meshing adapts the mesh to ensure accurate analysis of each device in the design. Easily define rules to provide meshing guidance and ensure individual objects are simulated accurately.

CFD Analysis

Perform fluid flow convection, conduction, and radiation heat transfer analysis with the powerful computational fluid dynamics (CFD) engine in Celsius. Easily visualize air flow and the effects of heat transfer in and around your system with CFD analysis.

CFD Analysis

Perform fluid flow convection, conduction, and radiation heat transfer analysis with the powerful computational fluid dynamics (CFD) engine in Celsius. Easily visualize air flow and the effects of heat transfer in and around your system with CFD analysis.

Accurate, Intelligent Meshing

Celsius models are built using a collection of over 100 intelligent objects designed specifically for electronics devices including PCBs, heat sinks, cold plate fans, enclosures, heat pipes, and more. For additional models, easily import complex MCAD models from Creo Parametric, SOLIDWORKS, and CATIA for analysis without simplification. Import PCB designs using the ODB++ or IPC2581 to preserve conductor layers, vias, and component sizes and positions for an accurate, detailed analysis.

Accurate, Intelligent Meshing

Celsius models are built using a collection of over 100 intelligent objects designed specifically for electronics devices including PCBs, heat sinks, cold plate fans, enclosures, heat pipes, and more. For additional models, easily import complex MCAD models from Creo Parametric, SOLIDWORKS, and CATIA for analysis without simplification. Import PCB designs using the ODB++ or IPC2581 to preserve conductor layers, vias, and component sizes and positions for an accurate, detailed analysis.

FEA Solvers

Celsius includes both 2.5D and 3D Finite Element Analysis (FEA) solvers for comprehensive analysis regardless of design complexity. The 2.5D FEA solver quickly and accurately simulates thermal conduction in 3D planar layered structures, such as packages and PCBs with multiple layers and interconnect vias. The 3D FEA solver provides accurate thermal conduction analysis and electrical simulation for arbitrary 3D structures, such as complicated packages with bumps or bonding wires, connectors, and transitions of connectors to the PCB.

FEA Solvers

Celsius includes both 2.5D and 3D Finite Element Analysis (FEA) solvers for comprehensive analysis regardless of design complexity. The 2.5D FEA solver quickly and accurately simulates thermal conduction in 3D planar layered structures, such as packages and PCBs with multiple layers and interconnect vias. The 3D FEA solver provides accurate thermal conduction analysis and electrical simulation for arbitrary 3D structures, such as complicated packages with bumps or bonding wires, connectors, and transitions of connectors to the PCB.

Massively Parallel Computational Solver

The innovative massive parallel solver technology included in Celsius accelerates simulation speeds up to 10 times compared to conventional thermal simulators and significantly reduces memory usage.

Massively Parallel Computational Solver

The innovative massive parallel solver technology included in Celsius accelerates simulation speeds up to 10 times compared to conventional thermal simulators and significantly reduces memory usage.

Want to Learn More?

Reach out to schedule a demo, ask questions, get a quote or take a test drive.

Additional Resources

Celsius Thermal Solver is Part of the Sigrity Product Family

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