Today’s high-speed PCB and system-level design demands fast, accurate simulation. This white paper explains how to choose the right electromagnetic (EM) solver—from 2D and hybrid methods to full 3D FEM—for every stage of the design process. Inside, you’ll learn:
- When to use 2D, 3D planar (hybrid), or full-wave 3D solvers
- How the cloud-native parallelized Cadence Clarity 3D Transient Solver dramatically reduces simulation time
- Best practices for cut-and-stitch and mixed-solver workflows
- How to speed up signoff without compromising accuracy
Whether you’re running early layout feasibility checks or preparing for signoff on a complex multi-layer PCB, this guide empowers you to balance simulation time with result fidelity.
