As electronic systems become smaller, denser, and more power-intensive, thermal management is no longer optional, it’s a critical determinant of product performance, reliability, and time-to-market. Traditional prototype-driven approaches to electronics cooling design are slow, costly, and often fail to uncover issues until late in the cycle.
Cadence Celsius EC is purpose-built for electronics cooling simulation enabling engineers to model airflow, temperature, and heat transfer across PCBs, packages, and full systems so thermal issues can be identified and resolved early in design. It is specifically designed to analyze complex electronic assemblies and enclosures, supporting all major modes of heat transfer and cooling strategies.
In our previous webinar, we focused on the fundamentals and theory behind electronics cooling. In this follow-up session, we move from theory to execution, demonstrating how to apply these principles in real-world workflows using Celsius EC.
This webinar is designed for engineers and teams who want to move beyond high-level concepts and understand how to implement electronics cooling analysis in their design process. Through a practical, end-to-end walkthrough, you’ll see how Celsius EC enables you to quickly build and analyze thermal models, evaluate cooling strategies, and make informed design decisions earlier when changes are less costly and easier to implement.
Through this practical guide to electronics cooling design with Cadence Celsius EC, you will learn:
- When and why to shift-left from physical testing to simulation for electronics cooling
- How to import electronic hardware data and prepare accurate system-level models
- Best practices for setting material properties, boundary conditions, and physics
- Meshing strategies that balance accuracy and performance
- How to run simulations, interpret results, and iterate on cooling design decisions
If you’re looking to design more reliable electronics, reduce costly late-stage changes, and bring products to market faster, this session will give you the practical insight needed to start applying electronics cooling simulation immediately.
Join industry expert Tobias Best form ALPHA-Numerics to see how Celsius EC enables a simulation-driven approach to electronics cooling design turning thermal analysis into a proactive, design-phase capability rather than a reactive failure-driven step.
