|

EMA Resources

Whitepaper

Home > EMA Resources > Whitepaper > Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

Whitepaper

Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

Targeting both pre-layout design and post-layout verification, the Celsius Thermal Solver enables users to quickly develop their product’s thermal management system and identify thermal stress-related issues that are among the leading field failure risks in electronic systems.
REQUEST INFO
DOWNLOAD PDF

Related Resources

Ebooks

Migrating from Eagle to OrCAD X

Like many companies selecting OrCAD X, you have existing or legacy designs you need to convert or translate into OrCAD X. The good news is that OrCAD X is supplied with an integrated and proven Eagle design translator built in. This guide will walk you through the steps and process
See Ebooks
Whitepaper

Migrating from Altium to OrCAD X

Like many companies selecting OrCAD X, you have existing or legacy designs you need to convert or translate into OrCAD X. The good news is that OrCAD X is supplied with an integrated and proven Altium Designer translator built in. This guide will walk you through the steps and process

See Whitepaper
Whitepaper

Rigid-Flex PCB Bending EM Analysis with Clarity

Learn how to perform Electromagnetic (EM) analysis when bending a rigid-flex design using Clarity 3D to ensure first-pass success.
See Whitepaper
Whitepaper

Overcoming Signal Integrity Challenges of 112G Connections

Learn how to handle signal integrity issues in 112G connections and ensure that data is transmitted successfully with minimal errors.
See Whitepaper
Whitepaper

RF to mmWave Design for Systems

With AWR Design Environment, address RF/ microwave design and integration through an Intelligent System Design™ strategy, which delivers computational software capabilities across all RF to mmWave Design for Systems design elements of electronic systems.
See Whitepaper
Whitepaper
Book Cover: Fundamentals of Component Data Management

Fundamentals of Component Data Management

If you are not exactly sure what Component Data Management (CDM) really is, or why it is important to you as an electrical engineer, you are reading the right article at the right time in your career.
See Whitepaper
Whitepaper

SE Connect BOM Risk Cheat Sheet

This cheat sheet is intended to provide defintions and additional explanation for categories within the SiliconExpert Connect BOM Risk App.
See Whitepaper
Whitepaper

SE Connect BOM Risk Sample Report

SE Connect BOM Risk App exports a PDF with supply chain details for your schematic design and components.
See Whitepaper
Whitepaper

Sunreef Yachts Case Study 2019

To satisfy a shift in customer preferences for highly customized luxury catamarans, Poland-based Sunreef Yachts needed to simulate and optimize their engineering processes to accelerate design and production of its boats.
See Whitepaper
Whitepaper

Wire Bond Profiles

Bond wires are 3D entities that connect a die pin to a package substrate finger or another die pin. This application note describes the process of defining Wire bond profiles and how they are applied to specific bond wires in the design.
See Whitepaper
Whitepaper

System Electrothermal Transient Analysis of a High Current (40A) Synchronous Step Down Converter

In this paper, we detailed the system electrothermal transient co-design modeling and silicon validation effort that led to the industry’s first highly efficient, highest power density (40A) synchronous step-down converter.
See Whitepaper
Whitepaper

Sigrity X – Redefining Signal and Power Integrity

This white paper highlights the features in Cadence® Sigrity™ X signal and power integrity (SI/PI) solutions for system-level SI and PI analysis that enable designers to cut the number of design respins and meet short time-to-market windows with confidence.
See Whitepaper

Contact Us

EMA Design Automation