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Update to the Cadence 24.1 Release

Get access to the latest in PCB design technologies, submit your update request below and the EMA team will be in touch with instructions.

Users with an active maintenance contract are eligible for this update. If you have any questions about your maintenance status or questions in general please don’t hesitate to contact us at info@ema-eda.com

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What's New in OrCAD X

What's New in Allegro X

See the Latest Info & News from EMA

PCB Electronics Supply Chain 2025: Status and Trends

Addressing your PCB electronics supply chain 2025 challenges requires understanding the impacts and adopting a resilience intelligence approach.

Investigating Return Path Discontinuities: Understanding Impacts and Effective Mitigation Strategies

In high-speed designs, properly managing these return paths is crucial for signal integrity, power integrity, and overall PCB performance.

Power Integrity Basics: 101

Understanding power integrity basics is essential. However, employing the best simulation tools is critical for implementing them in your design.

Introduction to PCB Thermal Analysis

This free e-book download will provide an introduction the PCB thermal analysis and how thermal analysis can be integrated at each stage of the design process to improve thermal behavior.

Best AI for Circuit Design and Analysis in 2025

To fully leverage the best AI for circuit design & analysis tools for 2025, good verification guidelines to ensure accuracy should be followed.

Simulation, Analysis, and Verification of High-Speed Digital Designs

Learn how to simulate, analyze, and verify your high-speed digital designs.

OrCAD X High-Speed Constraint Management

Get hands-on experience with a practical example of managing high-speed constraints in OrCAD X.

Understanding High-Speed Digital Design Problems

This ebook will help designers understand common high-speed digital design problems and how to manage them efficiently in OrCAD X.

PCB Thermal Resistance in Heat Transfer

Effective thermal resistance to heat transfer is essential for all designs and critical for high-power boards to ensure stable operation and performance.