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Home > EMA Resources > Whitepaper > Export DIE abstract (XDA) from Virtuoso for use with SiP Layout and OrbitIO

Whitepaper

Export DIE abstract (XDA) from Virtuoso for use with SiP Layout and OrbitIO

After going through this application note you will be able to export DIE data from IC (Virtuoso) to Cadence Chip packaging tool (SiP and OrbitIO).
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