Designing High-Density Interconnect (HDI) is becoming more common as smaller form factors are resulting in densely populated boards. This comprehensive guide to HDI design walks you through every step of the process, including:
- Building an HDI stackup
- Defining HDI via structures
- BGA Breakout and fanout strategies for HDI
- HDI routing strategies
- Thermal and power considerations for HDI
- DFM considerations and checks for HDI
- SI/PI Validation for HDI
- Fabrication documentation and outputs for HDI
What You Will Learn in Designing for HDI in Allegro X
This HDI design guide will provide insights to tackle even the most complex HDI challenges with confidence and will answer the following questions:
- What materials should be selected for the PCB stackup?
- What type of vias and via structures should be used for HDI?
- What are the typical parameters for microvia, blind via, buried via and via-in-pad definitions?
- What is the suggested strategy for completing BGA fanouts using HDI techniques?
- How do you leverage microvia flexibility while respecting electromagnetic constraints?
- How can thermal management for HDI be addressed during the PCB layout?
- What are the additional fabrication requirements for HDI?
- How do you model 3-dimensional electromagnetic behavior of microvia structures to ensure signal and power integrity?
- What documentation is required to properly fabricate HDI designs?
Allegro X and Sigrity X enable designers to easily incorporate and validate HDI techniques in their PCB layouts with a systematic workflow that addresses stackup definition, via structure configuration, constraint management, routing strategies, DFM verification, and SI/PI validation.
