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Home > EMA Resources > Webinars > Thermal Implications of Flip-Chip Technology for mmWave MMIC Amplifier Designs

WEBINAR

Thermal Implications of Flip-Chip Technology for mmWave MMIC Amplifier Designs

Duration: 55:22

This webinar delves into the thermal and RF performance of flip-chip technology in mmWave monolithic microwave integrated circuit (MMIC) amplifiers with a particular focus on K-band satellite downlink phased array applications. Flip-chip technology offers a compact packaging solution with high interconnect density and improved signal integrity.

In this webinar, you will learn:

Thermal management strategies
Viability of flip-chip technology
Integration between Cadence Microwave Office and Celsius Thermal Solver

Links

About the Presenters

Cadence Design Systems -

Cadence is a pivotal leader in electronic systems designs, building upon more than 30 years of computational software expertise. The Company applies its underlying Intelligent System Design strategy to delivery software, hardware, and IP that turn design concepts into reality.

WEBINAR

Thermal Implications of Flip-Chip Technology for mmWave MMIC Amplifier Designs

This webinar delves into the thermal and RF performance of flip-chip technology in mmWave monolithic microwave integrated circuit (MMIC) amplifiers with a particular focus on K-band satellite downlink phased array applications. Flip-chip technology offers a compact packaging solution with high interconnect density and improved signal integrity.

In this webinar, you will learn:

Thermal management strategies
Viability of flip-chip technology
Integration between Cadence Microwave Office and Celsius Thermal Solver

Duration: 55:22

Links

About the Presenters

Cadence Design Systems -

Cadence is a pivotal leader in electronic systems designs, building upon more than 30 years of computational software expertise. The Company applies its underlying Intelligent System Design strategy to delivery software, hardware, and IP that turn design concepts into reality.

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