HDI via design is one of the most critical aspects of High-Density Interconnect (HDI) PCB design. As component pitch decreases and routing density increases, HDI via design becomes far more than simple electrical connections between layers as they directly influence routability, signal integrity, power delivery, reliability, manufacturability, and cost.
This webinar will focus on the importance of understanding the advantages and limitations of HDI via design. The key is understanding how to to connect the signals and grounds through the board stackup. It is also essential to understand what is required to ensure proper thermal connections between the ICs and ground planes.
In this HDI Via Design webinar, you will learn:
- Electromagnetic field behavior in via structures
- How to design effective transmission lines and ground transition vias
- How to improve power delivery network performance
- How to enhance thermal management in high-density designs
