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Assuring power integrity of a PCB requires the contributions of multiple design team members. Traditionally, such an effort has involved a time-consuming process for a back-end-focused expert at the front end of a design. This paper examines a collaborative team-based approach that makes more efficient use of resources and provides more impact at critical points in the design process.

About Imagine Communications Imagine Communications, headquartered in Frisco, Texas, is a leading supplier of live production, playout, multiscreen delivery, and next-generation ad management solutions. Broadcasters, networks, video service providers, and enterprises around the world rely on the company’s optimized, future-proof, multiscreen video and revenue enablement solutions every day to support their mission-critical operations. Nearly half the world’s video channels traverse Imagine products, and its software solutions drive close to a third of global ad revenue. Boris Nevelev is a senior hardware design engineer at the company. Nevelev’s team works with the PCB design team to develop boards for high-definition video-processing equipment.

Allegro Sigrity SI Base (http://goo.gl/L1k5GX) and the System Serial Link Analysis Option (http://goo.gl/L03MLd) from Cadence are demonstrated.

Sigrity technologists guide you step by step on how to setup a leadframe package design for accurate extraction using the 3D quasi-static solver engine. Accurate RLC extraction is performed on a leadframe design from the same environment used to model multi-layer packages with other solver engines. Design productivity is improved by enabling a common environment to model leadframe, flip-chip, and wirebond IC Packages.

Allegro Sigrity SI Base and Power-Aware SI Option from Cadence are demonstrated. Sigrity technologists guide you step by step on how to utilize power-aware electric rule checks to confidently fast track the sign off process for your PCB designs.

The Cadence® Allegro® Sigrity™ PI integrated design and analysis environment streamlines the creation of power delivery networks (PDNs) on high-speed and high-current PCB systems and IC packages. A range of capabilities—from basic to advance—enable designers and electrical engineers to explore, optimize, and resolve issues related to electrical performance at all stages of the design cycle. By enabling an electrical constraint-driven design flow, this unique environment accelerates the time-to-design success while reducing the overall cost of end products.

Sigrity™ technology integrates seamlessly with Cadence® Allegro® PCB and IC packaging design solutions to deliver a complete power-aware design and signal integrity analysis solution. These production-proven tools enable power delivery system analyses across chip-package-board; systemlevel signal integrity analysis of high-speed signal transmissions; and, advanced physical design for single- and multi-chip packages, state-of-the-art 3D packages, and systems-in-package.